IndieRF Transmission Line Calculator
Microstrip insertion loss and 50 Ω width Hammerstad–Jensen Z0 and ε_eff(0), Kirschning–Pramann dispersion, and a 75/25 bottom-to-top current split through the plating stack. Auto-tune width to 50 Ω.
IndieRF Transmission Line Calculator
PCB traces and chip-and-wire
Save to memory Show theoretical formulationsTopology Microstrip Grounded CPW Stripline CPW (no ground) Substrate Rogers RO4350B (εr=3.66, tanδ=0.0037) Rogers RO4003C (εr=3.55, tanδ=0.0027) Rogers RO3003 (εr=3.00, tanδ=0.0010) Rogers RT/duroid 5880 (εr=2.20, tanδ=9.0e-4) Rogers RT/duroid 6002 (εr=2.94, tanδ=0.0012) Panasonic Megtron 6 (εr=3.60, tanδ=0.0020) Panasonic Megtron 7 (εr=3.40, tanδ=0.0020) Isola Astra MT77 (εr=3.00, tanδ=0.0017) Isola I-Tera MT40 (εr=3.45, tanδ=0.0031) Taconic TLY-5 (εr=2.20, tanδ=9.0e-4) Standard FR-4 (εr=4.40, tanδ=0.020) Alumina 96% (εr=9.40, tanδ=4.0e-4) Alumina 99.6% (εr=9.80, tanδ=1.0e-4) Aluminum nitride (AlN) (εr=8.80, tanδ=5.0e-4) Fused silica (εr=3.80, tanδ=4.0e-5) Borosilicate glass (εr=4.60, tanδ=0.0060) Sapphire (εr=9.40, tanδ=1.0e-4) GaAs (εr=12.90, tanδ=6.0e-4) High-resistivity silicon (εr=11.70, tanδ=0.0010) Silicon carbide (4H-SiC) (εr=9.70, tanδ=5.0e-4) Custom… Lock to 50 Ω (auto-tune width)Surface finish Bare copper Bare gold OSP (organic solderability) ENIG ENEPIG Immersion silver Immersion tin Hard gold Copper foil Standard ED (Rq 2.5 um) Reverse treated (RTF) (Rq 1.2 um) Very low profile (VLP) (Rq 0.6 um) Hyper very low profile (HVLP) (Rq 0.3 um) Roughness Huray snowball Hammerstad Solder mask None Flooded Relieved / windowed ⏚ ⏚ ⏚ ⏚ ⏚ Rogers RO4350B (εr=3.66, tanδ=0.0037) 8 mil relief W = 13.69 mil h = 6.60 mil t = 17.5 um Loss sweep · dB/in
total conductor dielectric mask
0.0 0.5 1.0 1.5 2.0 0.1 GHz 5 GHz 10 GHz 15 GHz 20 GHz Z0
50.00 ohm
eps_eff(f)
2.884
static 2.856
Loss
1.220 dB/in
0.0480 dB/mm
t_pd
143.89 ps/in
5.665 ps/mm
v_p
58.9 % c
177 km/s
f_TE1
548.2 GHz
Loss breakdown @ eval
Base Cu38.4% Plating25.1% Roughness25.3% Dielectric10.7% Mask0.5% Skin depth vs plating
99.8% of current in the plating shell, 0.2% in the copper core.
Foil Reverse treated (RTF): Rq = 1.2 um · Huray a = 0.7 um, As/Af = 1.4
Gold t=0.05 um · δ=0.79 um · 6.2%
σ = 4.10e7 S/m
Nickel t=4.50 um · δ=0.72 um · 93.7%
σ = 1.40e7 S/m · μr = 3.5
Copper core t=17.50 um · δ=0.66 um · 0.2%
σ = 5.80e7 S/m
ENIG vs copper note